About Us

The advancement of AI technology has dramatically enhanced semiconductor performance. However, behind this progress lies a new and unprecedented limitation—heat generation.
In AI semiconductor environments where computational load and integration density are increasing explosively, heat is no longer a secondary issue but a critical factor that directly determines performance and reliability.
Nevertheless, conventional thermal measurement technologies have shown clear limitations in precisely analyzing the thermal properties required by high-performance semiconductors and low-dimensional materials.

We began with this fundamental challenge in mind.
Through ultra-precise thermal property measurement technology based on nano- and micro-scale devices, we aim to accurately analyze domains that were previously unmeasurable and fundamentally resolve overheating issues in AI semiconductors. Our ±0.001°C ultra-high-precision measurement capability goes beyond numerical improvement—it serves as a foundational technology that enables stable operation of high-performance semiconductors and drives the advancement of next-generation semiconductor technologies.

Moving forward, we will continue to provide reliable data through precise measurement and establish new standards for thermal management technologies required in the AI semiconductor era.
Through continuous research and technological innovation, we will overcome the limitations faced by industry and technology together.

Thank you.