Business Overview

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Business Overview

Development of Ultra-Precise Thermal Property Measurement Sensors and Systems Using Nano/Micro Devices

The rapid increase in demand for AI semiconductors has significantly intensified heat generation issues due to higher integration density and increased computational workloads.
Conventional thermal measurement technologies face inherent limitations in analyzing low-dimensional materials, making them inadequate for precise thermal management of high-performance semiconductors. As a result, there is an urgent need for ultra-precise thermal property measurements to resolve overheating issues and ensure stable performance of AI semiconductors.
HeatMetricX has developed ultra-precise thermal property measurement sensors and systems based on nano/micro devices, enabling thermal characterization of low-dimensional materials for high-performance semiconductors with a precision of ±0.001°C.

Rapid growth in demand for AI and high-performance semiconductors
Increasing importance of semiconductor thermal management
Limitations of existing technologies

Challenges and Limitations of Existing Technologies

Technology Measurement Principle Measurable Sample Size
Laser Flash Method Indirect thermal conductivity measurement based on thermal diffusivity
Requires surface treatment of samples		 cm-scale
Hot Disk Method Indirect thermal conductivity measurement based on thermal diffusivity cm-scale
AC Lock-in Technique with Customized Micro Devices (HeatMetricX) Direct thermal conductivity measurement Down to nm-scale

Key Solution Features

  • This technology enables accurate temperature measurement at nano- and micro-scales, overcoming the limitations of conventional methods and supporting next-generation packaging design and reliability validation
  • By integrating precise temperature and heat flux sensors into a MEMS-based measurement platform, it enables thermal property characterization of low-dimensional materials such as thin films and nanowires
  • In addition, the application of AC-modulated lock-in techniques allows precise thermal measurements of complex structures and low-dimensional samples; a demonstration system is currently established at a research laboratory at the National University of Singapore

Prototype of the measurement system

Example of thermal conductivity analysis of low-dimensional samples such as polymer nanowires with diameters of approximately 40 nm

Technological Differentiation

The HeatMetricX Lock-in platform is built on ultra-precise micro thermal sensors and circuit technologies that overcome the limitations of existing approaches, providing a strong foundation for market entry and scalable expansion

Category Thermocouple IR Camera Laser Flash HeatMetricX
Measurement Method Contact-based, single-point Non-contact, image-based Heat transfer model-based MEMS-based
Precision 0.001°C 0.1°C 0.01°C 0.001°C
Measurement Target Single point Surface temperature Homogeneous materials Internal thermal distribution including microstructures
Limitations Not suitable for multi-point or microstructure measurements Cannot measure internal thermal distribution Not suitable for heterogeneous or multilayer structures Optimized for Chiplet and HBM package analysis
Remarks - - - Includes data analysis and process optimization services
Business No. 783-86-03616 CEO. Sunmi Shin E-mail. sshin@heatmetric.com
Address. Room 203-ji104, 2nd Floor, 15, Gyeryong-ro 105beon-gil, Yuseong-gu, Daejeon, South Korea