SNS HeatMetricX Introduces “In-Depth Thermal Metric” Platform for Advanced Semiconductor Packaging
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작성자 admin 작성일 26-08-28 15:13 조회 13회 댓글 0건본문
HeatMetricX’s “In-Depth Thermal Metric” platform for advanced semiconductor packaging was featured on the official KDB NextONE social media channel.
Building on its technology for the precise measurement and analysis of semiconductor thermal characteristics, HeatMetricX is developing a thermal analysis platform that goes beyond conventional surface-focused thermal analysis to characterize thermal behavior at different depths inside semiconductor devices.
The featured content highlights HeatMetricX’s technology and its potential applications in the field of advanced semiconductor packaging.
Channel: KDB NextONE / Instagram
Publication Date: Jun. 15, 2026
Original Title: The First “In-Depth Thermal Metric” Platform for Advanced Semiconductor Packaging — IN-DEPTH THERMAL METRIC, HeatMetricX