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HeatMetricX Introduces Ultra-Precision Thermal Characterization Technology to Address Heat Challenges in AI Semiconductors
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08-28
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HeatMetricX Introduces “In-Depth Thermal Metric” Platform for Advanced Semiconductor Packaging
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08-28
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HeatMetricX Showcases Semiconductor Thermal Analysis Platform at WIS 2026
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08-28
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HeatMetricX Showcases Advanced Semiconductor Thermal Analysis Technology at the “2026 K-AI Champions IR Day”
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08-28
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HeatMetricX Selected for the 12th Cohort of “KDB NextONE”
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08-28
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HeatMetricX Wins Grand Prize at the “Adventure & Challenging AI Startup Competition”
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08-28
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HeatMetricX Participates in the 17th KIBO Venture Camp Integrated Demo Day
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08-28
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CEO. Sunmi Shin
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