HeatMetricX Introduces Advanced Semiconductor In-Depth Thermal Analysis Technology in The Bell’s “Ventureium IN Silicon Valley” Interview > Newsroom

HeatMetricX introduced its technology for analyzing heat inside advanced semiconductor devices to identify defects, along with its global business strategy, through a company interview featured in The Bell’s “Ventureium in Silicon Valley” series.

HeatMetricX is developing a solution that uses its proprietary micro thermal sensors and AC-based thermal measurement technology to analyze the thermal characteristics inside semiconductor devices non-destructively. By interpreting the measured thermal signals, the technology can help identify defect locations and evaluate bonding quality. As AI semiconductors and 2.5D/3D advanced packaging become increasingly integrated, the importance of analyzing internal heat generation and micro-defects continues to grow, and HeatMetricX’s technology was introduced as a solution that can overcome the limitations of conventional surface-temperature measurement methods.

The interview also highlighted HeatMetricX’s strategy to expand into the U.S. AI semiconductor and advanced packaging market, leveraging its core technology and R&D capabilities in Singapore together with Korea’s strong semiconductor testing and validation environment. Going forward, HeatMetricX aims to develop its precision thermal measurement system into an in-line inspection platform that can be integrated into semiconductor manufacturing processes and establish new depth-based thermal indicators for semiconductor quality control.

Media Outlet: The Bell
Publication Date Sept. 16, 2026
Original Article Title Shin Sun-mi, CEO of HeatMetricX: “Reading Trapped Heat to Identify Defects”
Reporter Lee Sung-woo