News HeatMetricX Showcases Advanced Semiconductor Thermal Analysis Technology at the “2026 K-AI Champions IR Day”
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HeatMetricX participated as a presenting company at the “2026 K-AI Champions IR Day,” held during WIS 2026, where it introduced its thermal analysis technology for advanced semiconductor packaging.
The IR Day was organized by the Ministry of Science and ICT (MSIT), together with the National IT Industry Promotion Agency (NIPA) and the Korea Telecommunications Operators Association (KTOA), to connect promising AI companies with investors and expand opportunities for investment and business collaboration.
At the event, HeatMetricX CEO Sunmi Shin introduced the company’s “depth-resolved thermal metrics platform” for advanced semiconductor packaging and presented a non-destructive technology capable of tracking hotspots inside semiconductor chips.
Media Outlet: etnews
Publication Date: Apr. 23, 2026
Original Article: [WIS 2026] K-AI Champions Take the Stage for Real-World Investment Connections… Government to Provide KRW 1.2 Trillion in Support
Reporter: Park Jeong-eun